dsa 30 i 150 p a schottky diode gen 2 symbol definition r a t i n g s features / advantages: typ. max. i fsm i r a v 200 i a v f 0.93 r 0.85 k/w v r = 1 3 min. 30 t = 10 ms applications: v rrm v 150 0.9 t vj vc = t vj c =ma 5 package: part number v r = t vj =c i f =a v t c = 150c d = p tot 175 w t c c = t vj 175 c -55 v i rrm = = 150 30 30 t vj = 45c dsa 30 i 150 pa v a 150 v 150 25 25 25 max. repetitive reverse voltage reverse current forward voltage virtual junction temperature total power dissipation max. forward surge current conditions unit 1.09 t vj c =25 c j j unction capacitance v= v; 12 t 125 v f0 v 0.55 t vj = 175c r f 6 f = 1 mhz = c 25 m v 0.80 t vj =c i f =a v 30 0.98 i f =a 60 i f =a 60 threshold voltage slope resistance for power loss calculation only backside: cathode (50 hz), sine v f = 0.80 v housing: high performance schottky diode low loss and soft recovery single diode to-220 r industry standard outline r epoxy meets ul 94v-0 r rohs compliant r vj ma 289 pf thermal resistance junction to case thjc rectangular 0.5 very low vf extremely low switching losses low irm values improved thermal behaviour high reliability circuit operation low voltage peaks for reduced protection circuits low noise switching rectifiers in switch mode power supplies (smps) free wheeling diode in low voltage converters fav average forward current fav 125 ixys reserves the right to change limits, conditions and dimensions. 20100205b data according to iec 60747and per diode unless otherwise specified ? 2010 ixys all rights reserved
dsa 30 i 150 p a i rms a per pin 35 r thch k/w 0.50 m d nm 0.6 mounting torque 0.4 t stg c 150 storage temperature -55 weight g 2 symbol definition ratings typ. max. min. conditions rms current thermal resistance case to heatsink unit i is typically limited by: 1. pin-to-chip re sistance; or by 2. current capability of the chip. in case of 1, a common cathode/anode configuration and a non-isol ated backside, the whole current capability can be used by con necting the backside. f c n 60 mounting force with clip 20 ordering delivering mode base qty code key standard part name dsa 30 i 150 pa 504155 tube 50 xxxxxx yyww logo marking on product datecode assembly code abcdef product marking d s a 30 i 150 pa part number diode schottky diode low vf single diode to-220ac (2) = = = 1) 1 ) marking on product DSA30I150PA current rating [a] reverse voltage [v] = = = = rms ixys reserves the right to change limits, conditions and dimensions. 20100205b data according to iec 60747and per diode unless otherwise specified ? 2010 ixys all rights reserved
dsa 30 i 150 p a outlines to-220 ixys reserves the right to change limits, conditions and dimensions. 20100205b data according to iec 60747and per diode unless otherwise specified ? 2010 ixys all rights reserved
dsa 30 i 150 p a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50 60 0 50 100 150 0.0001 0.001 0.01 0.1 1 10 51525 0102030 0 5 10 15 20 25 30 0.001 0.01 0.1 1 10 0.1 1 0 40 80 120 160 200 0 10 20 30 40 050100150 100 200 300 400 500 600 700 a t vj =175c 150c 125c 100c 25c d= 0.5 d = dc 0.5 0.33 0.25 0.17 0.08 50c 75c i f [a] v f [v] i r [ma] v r [v] v r [v] c t [pf] t c [c] i f(av) [a] p (av) [w] z thjc [k/w] t [s] note: all curves are per diode fig. 1 maximum forward voltage drop characteristics fig. 2 typ. reverse current i r vs. reverse voltage v r fig. 3 typ. junction capacitance c t vs. reverse voltage v r fig. 4 average forward current i f(av) vs. case temperature t c fig. 5 forward power loss characteristics fig. 6 transient thermal impedance junction to case at various duty cycles i f(av) [a] t vj = 25c 125c 150c t vj = 25c dc r thi [k/w] 0.139 0.176 0.305 0.23 t i [s] 0.00028 0.0033 0.028 0.17 ixys reserves the right to change limits, conditions and dimensions. 20100205b data according to iec 60747and per diode unless otherwise specified ? 2010 ixys all rights reserved
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